Highly Integrated Low Power Sensor Node
Del Sarto, Marco Maierna, Amedeo Maggi, Luca Gritti, Alex Vinci, Luca Porzi, Claudio Santaera, Gaspare Scotti, Filippo Sorel, Marc Stefanini, Cesare
Del Sarto, Marco
Maierna, Amedeo
Maggi, Luca
Gritti, Alex
Vinci, Luca
Porzi, Claudio
Santaera, Gaspare
Scotti, Filippo
Sorel, Marc
Stefanini, Cesare
Supervisor
Department
Robotics
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Conference proceeding
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Abstract
The MEMS Sensor devices are in a very fast development era and the sensor-tile modules with multi-sensing functions are becoming a reality for system monitoring, especially in sensing matrix configurations. In particular, the focus on single package multi-sensing modules with Bluetooth® LE features are increasing their impact on several product areas. In wearable electronics, building management and bio-medical parameters monitoring environments, SiP (System in Package) approach with antenna set inclusion constitutes the leading solution in order to integrate a 2.45 GHz Bluetooth system. In the present paper we describe a novel packaging approach for integrating a plenitude of MEMS based sensors together with wireless connectivity and embedded processing power. The final component is characterized by small size and good RF performances.
Citation
M. Del Sarto, A. Maierna, L. Maggi, A. Gritti, L. Vinci, C. Porzi, G. Santaera, F. Scotti, M. Sorel, C. Stefanini, A. Bogoni, P. Castoldi, M. Chiesa, A.S. Rodrigo, D. Rotta, "Highly Integrated Low Power Sensor Node," 2025, pp. 1-6.
Source
Proceedings 2025 25th European Microelectronics and Packaging Conference and Exhibition Empc 2025
Conference
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Keywords
40 Engineering, 4009 Electronics, Sensors and Digital Hardware, 46 Information and Computing Sciences, 4605 Data Management and Data Science
Subjects
Source
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Publisher
IEEE